An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
On October 18, 2024, the U.S. Department of Commerce issued a NOFOto enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies. CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five research and development (R&D) areas with the potential for follow-on funding for prototyping activities.
The five R&D areas are:
Equipment, Tools, Processes, and Process Integration
Power Delivery and Thermal Management
Connector Technology, Including Photonics and Radio Frequency (RF)
Chiplets Ecosystem
Co-design/Electronic Design Automation (EDA)
Mandatory concept papers are due December 20, 2024. Concept papers received after this deadline will not be reviewed or considered.
The purpose of the CHIPS Research and Development (R&D) programs is to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. The CHIPS R&D programs have three goals:
Establish the capacity to invent, develop, prototype, and deploy the foundational semiconductor technologies of the future – here in America.
Accelerate ideas to market. We want the best ideas to achieve commercial scale as quickly and cost effectively as possible, and
Contribute to a robust semiconductor workforce. We want enough inventors, designers, researchers, developers, engineers, technicians, and staff to meet the needs of government and commercial sectors.
The CHIPS R&D programs address five cross-cutting issues that we identified through interactions with stakeholders:
Access to facilities and equipment for late-stage R&D and prototyping
To address these semiconductor R&D ecosystem gaps, CHIPS for America invests $11 billion in four integrated entities, all of which include some aspect of workforce training. These programs will share infrastructure, participants, and projects. They will operate in coordination with each other, with the CHIPS Incentives Program, and with microelectronics R&D programs supported by other U.S. federal agencies. CHIPS R&D programs will be informed by industry’s needs, and innovations from the R&D programs will accelerate innovation and increase competitiveness in the American semiconductor industry and establish our leadership in the sector for decades to come.
CHIPS National Advanced Packaging Manufacturing Program– The U.S. needs to develop the capability to package chips together in multiple dimensions with a variety of functions—known as advanced packaging—to regain and maintain leadership in semiconductor manufacturing. The NAPMP and NSTC will work closely together. Learn more about the NAPMP vision.
CHIPS Manufacturing USA Institute – CHIPS for America will fund a new Manufacturing USA institute dedicated to digital twin technology for semiconductor manufacturing technologies, and related workforce training.
CHIPS Metrology – NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods for semiconductors. NIST will also work on reference materials, reference data, and calibrations for the precision equipment used in chip manufacturing, and advise on the development of standards for processes and cybersecurity.
Across the entire semiconductor industry, issues related to thermomechanical mismatches encountered during packaging are limiting factors in the design and fabrication of 3D modular integrated circuits. This project will develop novel and necessary metrologies for thermomechanical properties of
Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects
Conventional TEM imaging was sufficient for decades in the semiconductor industry, but its utility is declining as device designs become more complex and as feature sizes continue to shrink. Conventional imaging modes are challenged by the small, complex structures which are vital to current and
EUV (extreme ultraviolet) lithography, the technology that “saved Moore’s Law,” is widely regarded as the future of cutting-edge nanofabrication. It was developed in the United States and U.S. companies in many parts of the EUV ecosystem have established dominance in the field that must be defended