The NIST Center for Nanoscale Science and Technology (CNST) supports the U.S. nanotechnology enterprise from discovery to production by providing industry, academia, NIST, and other government agencies with access to world-class nanoscale measurement and fabrication methods and technology.
The CNST's shared-use NanoFab gives researchers economical access to and training on a commercial state-of-the-art tool set required for cutting-edge nanotechnology development. The simple application process is designed to get projects started in a few weeks.
Looking beyond the current commercial state of the art, the CNST's NanoLab offers opportunities for researchers to collaborate on creating and using the next generation of nanoscale measurement instruments and methods. more...
New Identification Requirements for Entering the Nist Gaithersburg Campus
Beginning July 21, 2014, the identification requirements for entering the NIST site have changed as required by the 2005 “Real ID” Act. Driver’s licenses from eleven U.S. states (Alaska, Arizona, Kentucky, Louisiana, Maine, Massachusetts, Minnesota*, Montana, New York*, Oklahoma, Washington state*) and American Samoa will no longer be accepted as identification for U.S. citizens. Visitors with these licenses will need to present an approved form of alternative identification to gain access to NIST. State-issued Enhanced Driver’s Licenses from Minnesota, New York, and Washington state, which are identifiable by an American flag icon, may be used as valid identification for access to NIST.
A new JEOL 6300-FS direct write electron beam lithography system has been installed in the clean room, doubling the NanoFab’s capability in e-beam lithography. The new state-of-the-art system offers high resolution exposure capability and accommodates batch handling of substrates. The system is available to users through the NEMO system. For more information, contact Rich Kasica, 301-975-2693, firstname.lastname@example.org.
New Deep Silicon Etcher System Now Available
The CNST has purchased a new SPTS Omega c2L deep silicon etcher (DSE) which is now available to users in the NanoFab cleanroom. The new DSE can handle up to 200 mm diameter silicon wafer and can etch faster than the current deep silicon etcher in NanoFab. This new DSE also can provide smoother sidewall and better end point detection. This tool can be used to fabricate three-dimensional structures in silicon (Si) with vertical sidewalls of very high aspect ratio (> 50:1). Applications include fabricating micro/nano electro mechanical systems (MEMS/NEMS) such as accelerometers, ink jet heads, pressure sensors, gyroscopes, microphones, microactuators, and lab-on-chip devices.
For additional information, please contact Lei Chen, 301-975-2908.
New Lithography Coater System Now Available
A new Suss Microtec ASC200 Gen 3 automated resist coater has been installed in the NanoFab cleanroom. This system is able to perform spray and spin resist coating with automated wafer handling and resist baking. It is designed to be able to apply high quality resist film on a wide range of substrate shapes, sizes and topologies with consistent and uniform results. This new lithography resist coater is anticipated to enhance the quality, repeatability and throughput of NanoFab precision lithographic imaging.
For more information, contact Liya Yu, 301-975-4590.