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Wafer Dicing Saw: Disco Model 341

Description:

CORAL Name:  Dicing Saw

Need Description

Specifications / Capabilities:

  • Pieces up to 8" wafers
  • Approved training required

Scientific Opportunities / Applications:

  • Full wafer dicing
  • Auto cutting and semi-auto cutting modes
  • Used to dice silicon, sapphire, ceramic, metals, Pyrex, glass, epoxy substrates
  • Maximum material thickness < 0.50 in
  • Used for dicing photomasks, wafers, creating channels, troughs, gratings, ramps and sample preparation

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

NANOFAB USER MANUAL

SCHEDULE TRAINING

saw

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Gerard Henein
Phone: 301.975.5645
Email: nanofab_postprocess@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201