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Multipurpose Plasma Etcher System 2

Description:

CORAL Name:  Oxford Etcher 2

Oxford Plasmalab 100:  Highly flexible plasma etcher to selectively etch Si, SiO2, and SiNx on planar substrates up to 200 mm in diameter under variable temperatures.

Scientific Opportunities / Applications:

  • Anisotropic etching of SiO2 and SiNx
  • Low Temperature Si anisotropic etching
  • CF4 (in Si/SiO2 etching)
  • Photo-resist etching and descum

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

SCHEDULE TRAINING

System-100

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Lei Chen
Phone: 301.975.2908
Email: nanofab_dryetch@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201