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Silicon RIE: Unaxis 790

Description:

CORAL Name:  Unaxis RIE 2

A system based on Oxygen and Fluorine gases to etch polymer and dielectric materials on planar substrates up to 200 mm in diameter.

Specifications / Capabilities:

  • RF:  13.56 MHz
  • Power:  500W
  • Gases:  CHF3, CF4, SF6, N2O, O2

Scientific Opportunities / Applications:

  • Anisotropic thin film etch
  • Etches Silicon Dioxide, Silicon Nitride, Silicon, and Organics
  • Descum and Oxygen cleaning
  • SiNx Membrane

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

NANOFAB USER MANUAL

SCHEDULE TRAINING

si_rie

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Lei Chen
Phone: 301.975.2908
Email: nanofab_dryetch@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201