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Contact Aligner 2 (Front Side): Suss Microtec MA8

Description:

CORAL Name:  SussMA8

This system utilizes 1X contact lithography to transfer photomask patterns onto substrates

Specifications / Capabilities:

  • UV broadband (350 nm to 450 nm), I-line (365 nm) and G-line (436 nm) wavelength available. Contact super-user for installing I-line or G-line filters. 
  • Exposure methods: flood, proximity, soft and hard contacts, low vacuum and vacuum contacts. 
  • Mask size: 2.5"x 2.5", 4"x 4", 5"x 5" and 7"x 7" 
  • Wafer size for Top-Side Alignment: up to 6" in diameter (small samples, 2",3",4" and 6"). 
  • Wafer size for Bottom-Side Alignment: 3", 4", and 6" chucks 
  • Maximum wafer thickness: 3 mm

Scientific Opportunities / Applications:

  • The machine is exclusively intended for use as an alignment and/or exposure device for substrates used in Semiconductor and Microsystems Technology. 
  • Top and bottom side alignment to existing pattern 
  • Bond Alignment for Suss Microtec SB6e

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

NANOFAB USER MANUAL

SCHEDULE TRAINING

Suss MA8

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Chet Knurek
Phone: 301.975.2515
Email: nanofab_litho@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201