HMDS (hexamethyldisilzane) promotes photoresist adhesion by creating a bond between the resist and silicon. The silizanes bond to the silicon in the wafer while the methyls bond with the photoresist. Vapor priming allows for HMDS application in a monolayer and reduces the chance of contamination.
Specifications / Capabilities:
Quality of Coating
- Surface dehydration and subsequent vapor priming results in chemical bonding to surface hydroxyl ions, not weakly bound surface moisture
- Reesulting coatings are repeatable and stable for extended periods
Efficiency of Chemical Usage
- Uses less than 5 ml to coat up to 200 wafers
- System uses pure HMDS so there is no possibility of variation due to changes in carrier concentration
- Virtually no waste - no liquid solvents or residues to dispose of
Flexibility of Substrate Size and Shape
- Any size and shape substrate can be treated with equal efficiency up to 16"
- There are no issues with flow effects or substrate topology due to use of vapor
Flexibility of Type of Substrate
- Delicate or difficult substrates can be accommodated with simple temperature or recipie changes
- With no substrate movement during priming, there is no risk of breakage or other damage
HMDS is stored in the system under vacuum
- Chemical does not degrade from exposure to moisture in the air
- Operators are not exposed to fumes from the HMDS or carrier solvent
Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday). Out of hours access requires prior approval by the NanoFab Manager.