The MLA150 has been specifically designed for direct-wafer writing and easy operation. It offers all the capabilities that are required for single layer and multi-layer photolithography and even overcomes some of the limitations of photomask based exposure technologies because MLA150 exposure is non-contact approach. What set MLA150 apart from mask writer are the fast exposure speed, dual laser wavelengths and convenient alignment system. Alignment in multi-layer applications can be achieved automatically by using three integrated cameras with varying resolution while manual alignment is still available as needed.