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|Author(s):||Chukwudi A. Okoro; Yaw S. Obeng; Jan Obrzut; Pavel Kabos; Klaus Hummler;|
|Title:||Use of RF-Based Technique as a Metrology Tool for TSV Reliability Analysis|
|Published:||May 28, 2013|
|Abstract:||In this work, we used radio frequency (RF) based measurement technique is used as a prognostic tool for the assessment of the effect of thermal cycling on the reliability of through-silicon via (TSV) stacked dies. It was found that RF signal integrity in TSV daisy chains degraded with thermal cycling. Similar trend was also observed when the traditional DC resistance (RDC) measurement technique was used. Focused ion beam (FIB) based failure analysis, showed that the root cause for this trend was due to the formation and propagation of voids with thermal cycling. Many different failure modes were also identified.|
|Proceedings:||Proceeding of IEEE Electronic Components and Technology Conference (ECTC)|
|Pages:||pp. 186 - 191|
|Location:||Las Vegas, NV|
|Dates:||May 28-31, 2013|
|Research Areas:||Microelectronics, Materials Science, Electromagnetics|