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Robert Keller

Research Interests

Mechanical behavior of materials, failure analysis, reliability testing & physics, properties of thin films and nanomaterials, deformation, crystal defects, electron microscopy (TEM, SEM, CBED, EBSD).

Present project: Analytical Transmission SEM for Nanomaterials
National Research Council Post-Doctoral Opportunities: (you will be leaving NIST webspace)

Transmission Scanning Electron Microscopy for Nano- and Biotechnology

Applications of Transmission Scanning Electron Microscopy in Water Treatment and Sustainable Energy

Recently concluded project: Reliability Metrologies for Advanced Electronic Interconnects

Professional Activities: 

Symposium Organizer, Carbon-Based Electronic Devices – Processing, Performance, and Reliability, MRS (2010) - you will be leaving NIST webspace when selecting this link

Member, Material Measurement Laboratory People Council (links to internal NIST website), NIST (2007 to present)

Member, Boulder Editorial Review Board, NIST (2006 to 2009)

Organizer, NIST-NSF-CU Workshop on Materials Characterization for Nanoscale Reliability (2007)

Organizer, NIST-NSF-CU Workshop on Reliability Issues in Nanomaterials (2004)

Member, NIST Research Advisory Committee (1999-2001)

Symposium Organizer, Materials Reliability in Microelectronics VII, MRS (1997) - you will be leaving NIST webspace when selecting this link


Materials Research Society – member, symposium organizer

TMS – member

Semiconductor Research Corporation – technical advisory board member, nanoelectronics research initiative team member

Awards and Honors:

U.S. Department of Commerce Bronze Award – 2008
National Research Council Post-Doctoral Fellowship – 1993


Selected Publications:

RR Keller and RH Geiss, "Transmission EBSD from 10 nm domains in a scanning electron microscope," Journal of Microscopy 245, 245-251 (2012).

MC Strus, AN Chiaramonti, YL Kim, YJ Jung, and RR Keller, "Accelerated reliability testing of highly aligned single-walled carbon nanotube networks subjected DC electrical stressing," Nanotechnology 22, article 265713 (2011).

RR Keller, RH Geiss, N Barbosa, AJ Slifka, and DT Read, "Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects," Metallurgical and Materials Transactions 38A, 2263-2272 (2007).

Bob Keller 2013


Materials Research Engineer
Applied Chemicals and Materials Division
Nanoscale Reliability Group

Employment History:

2009 to present: Project Leader,  Nanoscale Reliability Group, Applied Chemicals & Materials Division, NIST

2001 to 2009: Group Leader, Nanoscale Reliability and Microscale Measurements Groups, Materials Reliability Division, NIST

2000 to 2001: Guest Scientist, Max-Planck-Institut für Metallforschung (Metals Research), Stuttgart, Germany

1995 to 2001: Materials Research Engineer, Materials Reliability Division, NIST

1993 to 1995: National Research Council Post-Doctoral Fellow, Materials Reliability Division, NIST

1991 to 1992: Visiting Scientist, Universität Erlangen-Nürnberg, Institut für Werkstoffwissenschaften (Materials Science), Erlangen, Germany

1983 to 1986: Materials and Process Engineering Technician, Honeywell, New Brighton, MN


Ph.D., Materials Science and Engineering, University of Minnesota, 1991

B.S., Materials Science and Engineering, University of Minnesota, 1986


Phone: 303-497-7651
Email: bob.keller@nist.gov
Fax: 303-497-5030