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Roy Geiss

Research Interests

My principal research tools are the transmission electron microscope, TEM, and the scanning electron microscope, SEM. My principal interests in research are broad and include strain tensor mapping using high resolution TEM, studies of magnetic, electrical and mechanical properties of single and multi-layer materials in the TEM including in-situ studies of magnetic sensor devices. With the SEM, I have been pursuing the use of electron backscattered diffraction, EBSD, to study strain in many different materials, including silicon, III-V optoelectronic materials and metals. I have also been using EBSD to study the crystallography of aluminum and copper interconnect structures.


Professional Affiliations

Materials Research Society

Microscopy Society of America

Mountain States Society of Electron Microscopy

American Crystallographic Association




Materials Research Engineer
Materials Reliability Division
Nanoscale Reliability Group

Employment History:

2002 to present: Materials Research Engineer, Materials Reliability Division, NIST, Boulder, CO

1998 to 2001: Senior Engineer, HDI-Failure Analysis Maxtor Corporation, Milpitas, CA

1992 to 1998: Senior Scientist, Applied Physics Department, USAF, McClellan AFB, CA, Technical Operations Division

1973 to 1992: Research Staff Member, IBM Research Division, Almaden Research Center, San Jose, CA

1967 to 1973: Senior Scientist, Department of Materials Science, University of Virginia, Charlottesville, VA


Ph.D., Applied Physics, Cornell University, Ithaca, NY

B.S. Physics, Lafayette College, Easton, PA


Phone: 303-497-4367
Fax: 303-497-5030