The following people have agreed to present invited talks at the 2015 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics. This list is subject to change.
Bill Bottoms, Third Millennium Test Solutions, "Material Requirements for 3D IC and Packaging"
Andre Clausner, Fraunhofer IKTS, "Combined Nanoindentation and AFAM for Mechanical Characterization of Ultra Low-k Thin Films"
Peter Czurratis, PVA Tepla, "New Scanning Acoustic Microscopy technologies applied to 3D integration applications"
- Andrea Ferrari, Univ. of Cambridge, "New Layered Materials"
Jurgen Gluch, TU Dresden/Fraunhofer IKTS, "X-ray Tomography for Process Development and Failure Analysis"
Karen Henry (Intel) and Thomas Kelley (Cameca Instruments, Inc.), "Advances in Atom Probe Metrology"
Paul Ho, University of Texas, "Thermo-Mechanical Reliability of TSVs"
Joseph Kline, National Institute of Standards and Technology, "Overview of Status of CD-SAXS for High Throughput Measurements"
Reinhold Krause-Rehberg, University Halle, "Positron Annihilation Spectroscopy Measurements for Porosimetry Determination of Micro- and Meso-porous Systems"
Philippe Leray, Imec, "Metrology for Patterning"
Markus Löffler and Walter Weber, Technical University Dresden, "Element and Strain Analysis in Si Nanowires"
Steve Pennycook, University of Tennessee, "Probing Optical and Electronic Properties of Defects Through Scanning Transmission Electron Microscopy and First-Principles Theory"
Sesh Ramaswami, Applied Materials, "Technology Requirement and Process Control Solutions"
Evan Reed, Stanford University, "Phase Change Properties and Strain Engineering in 2D Materials"
Jean-Luc Rouviere, CEA-Leti, "Strain Characterization at Nanoscale Using Electron Beam Based Techniques"
Frank Schwierz, TU-Ilmenau, "2D Materials Beyond Graphene for Future Electronics"
Thomas Silva, National Institute of Standards and Technology, "Characterization of Magnetic Nanostructures for STT-RAM Applications By Use Of Macro- and Micro-Scale Ferromagnetic Resonance"
Rick Silver, National Institute of Standards and Technology,
"Scatterfield Microscopy, Including the Fundamental Limits of Optical Defect
Valeriy Sukharev, Mentor Graphics, "DFM and DFR Requirements for 3D Stacked Systems to Materials Data and Characterization Techniques"
Tuyen Tran, Intel, "Defect Inspection for Advanced Technology Nodes"
Paul van der Heide, Global Foundries, "CMOS Characterization/Metrology Challenges for the Lab to the Fab"
Wilfried Vandervorst, Imec, "Paradigm Shift in Metrology for Probing 3D-Structrures and Confined Volumes"
Kris Vanstreels, Imec, "Challenges and Solutions for Chip-Package Interaction"
Suresh Venkatesan, Global Foundries, "Wide Perspective on Today's Semiconductor Industry"
- Klaus von Klitzing, Max-Planck-Institut FKF, "Nanoelectronics for Metrology"
Bob Westervelt, Harvard, "Imaging Electron Motion in Nanostructures"