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You searched on: Topic Area: Electronics Telecommunications Sorted by: date

Displaying records 1 to 10 of 346 records.
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1. Radiative damping in wave guide based FMR measured via analysis of perpendicular standing spin waves in sputtered Permalloy films
Topic: Electronics & Telecommunications
Published: 11/17/2015
Authors: Thomas J Silva, Justin M Shaw, Hans Toya Nembach, Mathias Weiler, Martin Schoen
Abstract: The damping α of the spinwave resonances in 75 nm, 120 nm, and 200 nm -thick Permalloy films is measured via vector-network- analyzer ferromagnetic-resonance (VNA-FMR). Inductive coupling between the sample and the waveguide leads to an addition ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=919208

2. Layered Double Hydroxide-Based Fire Re-sistant Coatings for Flexible Polyurethane Foam
Topic: Electronics & Telecommunications
Published: 11/5/2015
Authors: Yu-Chin Li, John R Shields, Rick D Davis
Abstract: Montmorillonite clay (MMT) is frequently used to create fire resistance in Layer-by-Layer (LbL) applied coatings. This manuscript reports that switching the MMT with layered double hydroxides (LDH) produced a more effective fire resistant coating on ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917056

3. ROLE OF SALT ON ADHESION OF AN EPOXY/ALUMINUM (OXIDE) INTERFACE IN AQUEOUS ENVIRONMENTS
Topic: Electronics & Telecommunications
Published: 11/5/2015
Authors: Kar T. Tan, Christopher C White, Donald Lee Hunston, Justin M Gorham, Michael Imburgia, Aaron M Forster, Vogt D Bryan
Abstract: Engineering joints consisting of polymer/inorganic interfaces are commonly exposed to less than ideal conditions during normal service; these environmental conditions present a significant challenge for maintaining the structural integrity of the int ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912935

4. The NIST Plan for Providing Public Access to Results of Federally Funded Research
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 8084
Topic: Electronics & Telecommunications
Published: 10/27/2015
Authors: Katherine E Sharpless, Regina Lorraine Avila, Sally Skidmore Bruce, Wo L Chang, Robert M Dimeo, Virginia Covahey, Alan K Dohne, Heather M Evans, Aaron P Fein, Donna J Kimball, Andrea M Medina-Smith, Alan Edwin Munter, James K Olthoff, Dianne L Poster, Kathleen M Roberts, Susannah B Schiller, John Henry j Scott, Barbara P Silcox, James A St Pierre, Mark D Stiles
Abstract: Documentation of the evolution of NIST's plan for providing public access to results of federally funded research is provided, including the plan itself, responses to comments made by NIST staff, and public comments received in response to a requ ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=919416

5. Software-defined Radio Based Measurement Platform for Wireless Networks
Topic: Electronics & Telecommunications
Published: 10/16/2015
Authors: I-Chun Chao, Kang B Lee, Richard Candell, Frederick M Proctor, Chien-Chung Shen
Abstract: There has been a dramatic push to adopting wireless networking technologies and protocols (such as 802.11, ZigBee, WirelessHART, Bluetooth, ISA100.11a, etc.) into time-critical networks. End-to-end latency is critical to many distributed applications ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=918707

6. Cracking and delamination behaviors of photovoltaic backsheet after accelerated laboratory weathering
Topic: Electronics & Telecommunications
Published: 9/23/2015
Authors: Chiao-Chi Lin, Yadong Lyu, Donald Lee Hunston, Jae Hyun Kim, Kai-Tak Wan, Deborah L Stanley, Xiaohong Gu
Abstract: The channel crack and delamination phenomena that occurred during tensile tests were utilized to study surface cracking and delamination properties of a multilayered backsheet. A model sample of commercial PPE (polyethylene terephthalate (PET)/PE ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=919057

7. Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics
Topic: Electronics & Telecommunications
Published: 9/23/2015
Authors: Aric Warner Sanders, Anna E Fox, Paul David Dresselhaus
Abstract: Superconducting electronics is an established technological field for sensors, quantum computation and quantum-based standards and is emerging as an important low-power alternative to semiconductors. As in any electronics fabrication, the production ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917945

8. Simulated Sinewave Testing of DataAcquisition Systems using SineFitting and Discrete Fourier Transform Methods Part 1: Frequency Offset, Random, Quantization, and Jitter Noise
Series: NIST Interagency/Internal Report (NISTIR)
Topic: Electronics & Telecommunications
Published: 7/30/2015
Authors: Jon C Geist, Muhammad Yaqub Afridi
Abstract: This report studies the effect of frequency offset, quantization error, random additive noise, and random phase jitter on the results of sine fitting and performing Discreet Fourier Transforms (DFT) of measurements of sinewaves with Data Acquisition ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=918705

9. Experimentally, How Does Cu TSV Diameter Influence its Stress State?
Topic: Electronics & Telecommunications
Published: 5/27/2015
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Ruqing Xu
Abstract: In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=918579

10. Electro-thermal Simulation of 1200 V 4H-SiC MOSFET Short-Circuit SOA
Topic: Electronics & Telecommunications
Published: 5/10/2015
Authors: Tam Hoang Duong, Jose Miguel Ortiz, David Warren Berning, Allen R Hefner Jr., Sei-Hyung Ryu, John W. Palmour
Abstract: The purpose of this paper is to introduce a dynamic electro-thermal simulation and analysis approach for device design and short-circuit safe-operating-area (SOA) characterization using a physics-based electro-thermal Saber®* model. Model parameter e ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=918177



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