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11. Nanoparticle Released from Consumer Products: Flooring Nanocoatings and Interior Nanopaints
Series: Technical Note (NIST TN)
Report Number: 1835
Topic: Manufacturing
Published: 7/21/2014
Authors: Li Piin Sung, Tinh T. Nguyen, Andrew Keith Persily
Abstract: Nanoparticles are increasingly incorporated in flooring coatings and interior paints to improve their abrasion and microbial resistance. One particular concern of this application is the release of nanoparticles from these surfaces due to repeated m ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914979

12. Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
Topic: Manufacturing
Published: 7/1/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; on ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915348

13. Effects of Temperature on Surface Accumulation and Release of Silica Nanoparticles in an Epoxy Nanocoating Exposed to UV Radiation
Topic: Manufacturing
Published: 6/16/2014
Authors: Chun-Chieh Tien, Ching-Hsuan Chang, Bernard Hao-Chih Liu, Deborah L Stanley, Savelas A Rabb, Lee Lijian Yu, Tinh T. Nguyen, Li Piin Sung
Abstract: Polymer nanocoatings are increasingly used outdoors and in harsh environments. However, because most common polymers degraded by the weathering elements, nanoparticles in polymer nanocoatings may be released into the environments. Such nanoparticle r ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915955

14. Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
Topic: Manufacturing
Published: 6/14/2014
Authors: Chukwudi Azubuike Okoro, James Marro, Yaw S Obeng, Kathleen Richardson
Abstract: In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915535

15. Uncertainty in Measurement of the Maximum Cutting Tool Temperature by Infrared Thermography
Topic: Manufacturing
Published: 6/13/2014
Authors: Brandon M Lane, Eric Paul Whitenton, Viswanathan Madhavan, M Alkan Donmez
Abstract: This paper presents an analysis of the uncertainty in measurement of the peak temperature on the side face of a cutting tool by infrared thermography. An analytical method uses the temperature measurement equation to study the uncertainty arising f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915534

16. BPMN Profile for Operational Requirements
Topic: Manufacturing
Published: 6/2/2014
Authors: Conrad E Bock, Raphael R. Barbau, Anantha Narayanan Narayanan
Abstract: An important aspect of systems and products is how they interact with their environment, including how they are operated. Behaviors external to systems usually involve people not trained in the details of how systems are designed and built, but who ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914621

17. Infrared Thermography of the Chip-Tool Interface through Transparent Cutting Tools
Topic: Manufacturing
Published: 6/2/2014
Authors: Thejas T. Menon, Viswanathan Madhavan
Abstract: In-situ observation of the chip-tool interface has been carried out while machining Ti-6Al-4V. A low-noise camera sensitive to visible and near infrared (IR) radiation has been used to record the radiation emitted by the interface, and relatively lon ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915381

18. X-Ray Micro-Beam Diffraction Measurement of the Effect of Thermal Cycling on Stress in Cu TSV: A Comparative Study
Topic: Manufacturing
Published: 5/26/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: Microelectronic devices are subjected to constantly varying temperature conditions during their operational lifetime, which can lead to their failure. In this study, we examined the impact of thermal cycling on the evolution of stresses in Cu TSVs us ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915644

19. A portrait of an ISO STEP tolerancing standard as an enabler of smart manufacturing systems
Topic: Manufacturing
Published: 5/21/2014
Authors: Allison Barnard Feeney, Simon Paul Frechette, Vijay Srinivasan
Abstract: The International Organization for Standardization (ISO) has just completed a major effort on a new standard ISO 10303-242 titled ,Managed Model Based 3D Engineering.‰ It belongs to a family of standards called STEP (STandard for the Exchange of Prod ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915430

20. 2D and 3D Topography Comparisons of Toolmarks Produced from Consecutively Manufactured Chisels and Punches.
Topic: Manufacturing
Published: 5/20/2014
Authors: Xiaoyu A Zheng, Johannes A Soons, Robert Meryln Thompson, John Villanova, Taher Kakal
Abstract: A 2009 report by the National Academies [1] recommended strengthening the scientific basis of procedures and criteria employed by the forensic science specialty of toolmark identification. The current method of comparison and determination of ide ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914887



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