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Topic Area: Materials Science

Displaying records 11 to 20 of 533 records.
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11. Nanoscale Imaging and Spectroscopy of Plasmonic Modes with the PTIR technique
Topic: Materials Science
Published: 8/1/2014
Authors: Aaron Michael Katzenmeyer, Jungseok Chae, Richard J Kasica, Glenn E Holland, Basudev Lahiri, Andrea Centrone
Abstract: The collective oscillation of conduction electrons in plasmonic nanomaterials allows the coupling of propagating light waves with nanoscale volumes of matter (,hot spotsŠ) and allows engineering their optical response from the UV to THz as a function ...

12. Performance Metrics for Evaluating Object and Human Detection and Tracking Systems
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7972
Topic: Materials Science
Published: 7/31/2014
Authors: Afzal A Godil, Roger V Bostelman, William P Shackleford, Tsai Hong Hong, Michael O Shneier
Abstract: In this report, we provide an overview of various performance evaluation metrics for object detection and tracking for robot safety applications in smart manufacturing. We present four different types of performance evaluation metrics based on detect ...

13. Dielectric characterization by microwave cavity perturbation corrected for non-uniform fields
Topic: Materials Science
Published: 7/23/2014
Authors: Nathan Daniel Orloff, Jan Obrzut, Christian John Long, Thomas Fung Lam, James C Booth, David R Novotny, James Alexander Liddle, Pavel Kabos
Abstract: The non-uniform fields that occur due to the slot in the cavity through which the sample is inserted and those due to the sample geometry itself decrease the accuracy of dielectric characterization by cavity perturbation at microwave frequencies. ...

14. From atoms to steps: the microscopic origins of crystal growth.
Topic: Materials Science
Published: 7/1/2014
Authors: Paul N. Patrone, T L Einstein, Dionisios Margetis

15. Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
Topic: Materials Science
Published: 7/1/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; on ...

16. Simultaneous Imaging of the Ferromagnetic and Ferroelectric Structure in Multiferroic Heterostructures
Topic: Materials Science
Published: 7/1/2014
Authors: John Unguris, Samuel R Bowden, Daniel Thornton Pierce, M. Trassin, R. Ramesh, S.- W. Cheong, Sean Fackler, Ichiro Takeuchi
Abstract: Combining ferromagnetic and ferroelectric materials has produced exciting new opportunities to design and produce structures with new functionalities.1,2,3 In particular, ferromagnetic/ferroelectric multilayers provide a means of making nanodevices w ...

17. Synchrotron-Based Measurement of the Impact of Thermal Cycling on the Evolution of Stresses in Cu Through-Silicon Via
Topic: Materials Science
Published: 6/30/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Ruqing Xu, Klaus Hummler, Yaw S Obeng
Abstract: One of the main causes of failure during the lifetime of microelectronics devices is their exposure to fluctuating temperatures. In this work, synchrotron-based X-ray micro-diffraction is used to study the evolution of stresses in copper through-sili ...

18. Multi-method analysis of multiwall carbon nanotube polymer nanocomposite samples after photodegradation
Topic: Materials Science
Published: 6/16/2014
Authors: Elijah J Petersen, Thomas Fung Lam, Justin M Gorham, Keana C K Scott, Christian John Long, Renu Sharma, Li Piin Sung, James Alexander Liddle, Tinh Nguyen
Abstract: Nanomaterials can be used as nanofillers to enhance the properties of polymeric materials. However, the effect of weathering on nanocomposites and the potential for nanomaterial release is not yet well understood. Multiple analytical methods are ne ...

19. Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
Topic: Materials Science
Published: 6/14/2014
Authors: Chukwudi Azubuike Okoro, James Marro, Yaw S Obeng, Kathleen Richardson
Abstract: In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their ...

20. Quantifying Crystallinity in High Molar Mass Poly(3-hexylthiophene)
Topic: Materials Science
Published: 6/3/2014
Authors: Chad R Snyder, Ryan C Nieuwendaal, Dean M DeLongchamp, Christine K Luscombe, Prakash Sista, Shane D Boyd
Abstract: We extend a recent comprehensive study of 3-hexylthiophene oligomers to high molar mass poly(3-hexylthiophene) (P3HT) fractions, such as those used in organic photovoltaic devices. Through a combination of differential scanning calorimetry (DSC) and ...

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