@article{1251436,
  author = {Daniel Josell and Thomas P. Moffat and Thomas Gnaupel-Herold and David Raciti and Martin Stauber and Yu Q and Liyang Chen and M Rawlik and Marco Stampanoni and Lucia Romano},
  title = {Bottom-up Au Filling of Trenches in Curved Wafers},
  year = {2024},
  month = {2024-03-04 05:03:00},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=957307},
  doi = {https://doi.org/10.1149/1945-7111/ad2958},
  language = {en},
}