@conference{772546,
  author = {David Read and Yi-Wen Cheng and Roy Geiss},
  title = {Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures},
  year = {2004},
  month = {2004-11-19 00:11:00},
  publisher = {Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50059},
  language = {en},
}