@conference{777151,
  author = {George Harman and C Johnson},
  title = {Wire Bonding to Advanced Copper-Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations},
  year = {2001},
  month = {2001-11-01 00:11:00},
  publisher = {Proc.,  IMAPS, Baltimore, MD, USA},
  language = {en},
}