@article{809236,
  author = {Trevor Braun and Daniel Josell and Manoj Silva and Thomas Moffat},
  title = {Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias},
  year = {2019},
  number = {1},
  month = {2019-01-18 00:01:00},
  publisher = {Journal of the Electrochemical Society},
  doi = {https://doi.org/10.1149/2.0341901jes},
  language = {en},
}