TY  - CONF
AU  - Tao, Ran
AU  - Phansalkar, Sukrut Prashant
AU  - Forster, Aaron M.
AU  - Han, Bongtae
C2  - 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, US
DA  - 2023-08-03 04:08:00
DO  - https://doi.org/10.1109/ECTC51909.2023.00225
LA  - en
PB  - 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, US
PY  - 2023
TI  - Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936408
ER  -