TY  - CONF
AU  - Enright, Lucas
AU  - Olszewska-Placha, Marzena
AU  - Hill, Michael
AU  - Phommakesone, Say
AU  - Kato, Daisuke
AU  - Hill, Charles
AU  - Kahari, Hanna
AU  - Lee, Chiawen
AU  - Chen, Chang-Sheng
AU  - Orloff, Nate
AU  - Celuch, Malgorzata
AU  - Ray, Urmi
C2  - 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP
DA  - 2023-05-23 04:05:00
DO  - https://doi.org/10.23919/ICEP58572.2023.10129693
LA  - en
PB  - 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP
PY  - 2023
TI  - Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936252
ER  -