TY  - CONF
AU  - Nakamura, Nathan
AU  - Szypryt, Paul
AU  - Fowler, Joseph
AU  - Levine, Zachary H.
AU  - Swetz, Daniel
C2  - 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), Huntsville, AL, US
DA  - 2023-11-20 05:11:00
DO  - https://doi.org/10.1109/PAINE58317.2023.10318004
LA  - en
PB  - 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), Huntsville, AL, US
PY  - 2023
TI  - Nanoscale X-ray Tomography of Integrated Circuits using a Hybrid Electron/X-ray Microscope: Results and Prospects
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=956624
ER  -