TY  - JOUR
AU  - Drexler, Elizabeth
C2  - Journal of Electronic Materials
DA  - 1999-05-01
LA  - en
M1  - 28
PB  - Journal of Electronic Materials
PY  - 1999
TI  - Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C
ER  -