TY  - JOUR
AU  - Drexler, Elizabeth
C2  - IEEE Transactions on Advanced Packaging
DA  - 2000-11-01
LA  - en
M1  - 23
PB  - IEEE Transactions on Advanced Packaging
PY  - 2000
TI  - Plastic Strain in Thermally Cycled Flip-Clip PBGA Solder Bumps
ER  -