TY  - JOUR
AU  - Kim, H
AU  - Wu, Wen-Li
AU  - Bauer, Barry
AU  - Lin, Eric
AU  - Kim, J
AU  - Kim, Y
AU  - Lee, V.
C2  - Proceedings of the IEEE International Interconnect Technology Conference
DA  - 2002-01-01
LA  - en
M1  - 60(1)
PB  - Proceedings of the IEEE International Interconnect Technology Conference
PY  - 2002
TI  - Structural Characterization of Porous Low-k SiOC Thin Films Using Novel X-Ray Porosimetry
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851998
ER  -