TY  - JOUR
AU  - Kim, Soo
AU  - Josell, Daniel
AU  - Moffat, Thomas
C2  - Journal of the Electrochemical Society
DA  - 2006-07-05
LA  - en
M1  - 153
PB  - Journal of the Electrochemical Society
PY  - 2006
TI  - Electrodeposition of Copper in the PE-PEG-C1-SPS Additive System Reduction of Overfill Bump Formation During Cu Superfilling
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853408
ER  -