TY  - CONF
AU  - Harman, George
C2  - Proc., Second Symposium on Electronic Packaging Technology, Shanghai, CH
DA  - 1997-12-31
LA  - en
PB  - Proc., Second Symposium on Electronic Packaging Technology, Shanghai, CH
PY  - 1997
TI  - Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001
ER  -