TY  - JOUR
AU  - Okoro, Chukwudi
AU  - Lau, June
AU  - Obeng, Yaw
AU  - Hummler, Klaus
C2  - IEEE Transactions on Electron Devices
DA  - 2014-01-01
LA  - en
M1  - 61
PB  - IEEE Transactions on Electron Devices
PY  - 2014
TI  - A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=913115
ER  -