TY  - JOUR
AU  - Grummel, Brian
AU  - Mustain, Habib
AU  - Shen, Z.
AU  - Hefner, Allen
C2  - IEEE Transactions on Components Packaging and Manufacturing Technology
DA  - 2015-11-19
DO  - https://doi.org/10.1109/TCPMT.2015.2489686
LA  - en
M1  - 5
PB  - IEEE Transactions on Components Packaging and Manufacturing Technology
PY  - 2015
TI  - Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement
ER  -