TY  - JOUR
AU  - Kim, Munsuk
AU  - Ropitault, Tanguy
AU  - Lee, SuKyoung
AU  - Golmie, Nada
C2  - IEEE Communications Letters
DA  - 2017-12-01
DO  - https://doi.org/10.1109/LCOMM.2017.2747511
LA  - en
M1  - 21
PB  - IEEE Communications Letters
PY  - 2017
TI  - Throughput Study for Channel Bonding in IEEE 802.11ac Networks
ER  -