TY  - JOUR
AU  - Chamberlin, Richard
AU  - Williams, Dylan
C2  - IEEE Transactions on Microwave Theory and Techniques
DA  - 2018-10-22
DO  - https://doi.org/10.1109/TMTT.2018.2873333
LA  - en
M1  - 66
PB  - IEEE Transactions on Microwave Theory and Techniques
PY  - 2018
TI  - Measurement and Modeling of Heterogeneous Chip-Scale Interconnections
ER  -