TY  - JOUR
AU  - Braun, Trevor
AU  - Josell, Daniel
AU  - Moffat, Thomas
AU  - John, Jimmy
C2  - Journal of the Electrochemical Society
DA  - 2019-10-01
LA  - en
M1  - 167
PB  - Journal of the Electrochemical Society
PY  - 2019
TI  - Simulation of Copper Electrodeposition in Through-Hole Vias
ER  -