TY  - JOUR
AU  - Okoro, Chukwudi
AU  - Kabos, Pavel
AU  - Obrzut, Jan
AU  - Hummler, Klaus
AU  - Obeng, Yaw
C2  - IEEE Transactions on Electron Devices
DA  - 2013-06-01
DO  - https://doi.org/10.1109/TED.2013.2257791
LA  - en
M1  - 60
PB  - IEEE Transactions on Electron Devices
PY  - 2013
TI  - Accelerated Stress Test Assessment of Through-Silicon Vias Using RF Signals
ER  -