TY  - JOUR
AU  - Grummel, Brian
AU  - Mustain, Habib
AU  - Shen, Z.
AU  - Hefner, Allen
C2  - IEEE Transactions on Components Packaging and Manufacturing Technology
DA  - 2013-04-09
LA  - en
M1  - PP
PB  - IEEE Transactions on Components Packaging and Manufacturing Technology
PY  - 2013
TI  - Thermo-Mechanical Characterization of Au–In Transient Liquid Phase Bonding Die-Attach
ER  -