TY  - CONF
AU  - Allen, Richard
AU  - Ray, Urmi
AU  - Ramachandran, Vidhya
AU  - Ali, Iqbal
AU  - Read, David
AU  - Fehk¿hrer, Andreas
AU  - Burggraf, J¿rgen
C2  - International Wafer-Level Packaging Conference, San Jose, CA
DA  - 2012-11-07
LA  - en
PB  - International Wafer-Level Packaging Conference, San Jose, CA
PY  - 2012
TI  - EVALUATING METHODS OF SHIPPING THIN SILICON WAFERS FOR 3D STACKED APPLICATIONS
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=912462
ER  -