TY  - JOUR
AU  - Keller, Robert
AU  - Read, David
AU  - Shaviv, Roey
AU  - Harm, Greg
AU  - Kumari, Sangita
C2  - Microelectronic Engineering
DA  - 2011-05-15
LA  - en
PB  - Microelectronic Engineering
PY  - 2011
TI  - Electromigration of Cu Interconnects Under AC and DC Test Conditions
ER  -