TY  - CONF
AU  - Allen, Richard
AU  - Baylies, Winthrop
AU  - Langer, Paul
AU  - Danzl, Ralph
AU  - DelRio, Frank
AU  - Horn, Gavin
AU  - Knechtel, Roy
AU  - Mattes, Michael
AU  - Read, David
AU  - Sood, Sumant
AU  - Turner, Kevin
C2  - Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, -1
DA  - 2009-12-07
LA  - en
PB  - Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, -1
PY  - 2009
TI  - A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=904232
ER  -