TY  - CONF
AU  - Berning, David
AU  - Reichl, John
AU  - Jr., Allen Hefner
AU  - Hernandez, Mora
AU  - Hood, Colleen
AU  - Lai, Jih-Sheng
C2  - Proc.,  IEEE Industry Applications Society (IAS) Annual Meeting, Salt Lake City, UT, USA
DA  - 2003-10-12 00:10:00
LA  - en
PB  - Proc.,  IEEE Industry Applications Society (IAS) Annual Meeting, Salt Lake City, UT, USA
PY  - 2003
TI  - High Speed IGBT Module Transient Thermal Response Measurements for Model Validation
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31382
ER  -