TY  - CONF
AU  - Kantor, Y.
AU  - Janezic, Michael
AU  - Kabos, Pavel
AU  - Riddle, Billy
AU  - Baker-Jarvis, James
C2  - Intl. Microelectronics and Packaging Soc., Denver, CO
DA  - 2001-03-26 00:03:00
LA  - en
PB  - Intl. Microelectronics and Packaging Soc., Denver, CO
PY  - 2001
TI  - Dielectric Properties of Materials for Packaging from 1 to 60 GHz
ER  -