TY  - CONF
AU  - Rodriguez, J
AU  - Reichl, John
AU  - Parrilla, Zharadeen
AU  - Jr., Allen Hefner
AU  - Berning, David
AU  - Velez-Reyes, M
AU  - Lai, Jih-Sheng
C2  - Proc., 2002 IEEE Industry Application Society, Pittsburgh, PA, USA
DA  - 2002-10-24 00:10:00
LA  - en
PB  - Proc., 2002 IEEE Industry Application Society, Pittsburgh, PA, USA
PY  - 2002
TI  - Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=30113
ER  -