TY  - CONF
AU  - Jones, M.
AU  - Roberts, John
AU  - Hood, Colleen
AU  - Cresswell, Michael
AU  - Allen, Richard
C2  - Proc., IEEE International Conference on Microelectronic Test Structures, Kyoto, 1, JA
DA  - 1991-12-31 00:12:00
LA  - en
M1  - 4
PB  - Proc., IEEE International Conference on Microelectronic Test Structures, Kyoto, 1, JA
PY  - 1991
TI  - Test Chip for the Evaluation of Surface Diffusion Phenomena in Sputtered Aluminum Planarization Processes
ER  -