TY  - CONF
AU  - Harman, George
AU  - Wilson, Charles
C2  - Proc. MRS Symposium on Electronics Packaging, San Diego, CA, USA
DA  - 1989-12-31 00:12:00
LA  - en
M1  - 154
PB  - Proc. MRS Symposium on Electronics Packaging, San Diego, CA, USA
PY  - 1989
TI  - Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices
ER  -