TY  - SER
AU  - Lang, Klaus-Dieter
AU  - Harman, George
AU  - Schneider-Ramelo, Martin
C2  - dpp Golden Bogen, Dresden, GE
DA  - 2005-01-27 00:01:00
LA  - en
PB  - dpp Golden Bogen, Dresden, GE
PY  - 2005
TI  - Modern wire bonding technologies - ready for the challenges of future microelectronic packaging
ER  -