TY  - CONF
AU  - Harman, George
AU  - Johnson, C
C2  - Proc.,  IMAPS, Baltimore, MD, USA
DA  - 2001-11-01 00:11:00
LA  - en
PB  - Proc.,  IMAPS, Baltimore, MD, USA
PY  - 2001
TI  - Wire Bonding to Advanced Copper-Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations
ER  -