TY  - CONF
AU  - Sunday, Christopher
AU  - Veksler, Dmitry
AU  - Cheung, Kin
AU  - Obeng, Yaw
C2  - ECS Transactions Vol 76, 2017: Dielectrics for Nanosystems 8: Materials Science, Processing, 
Reliability, and 
Manufacturing -and- Solid State Topics, New orleans, LA, US
DA  - 2017-05-30 00:05:00
DO  - https://doi.org/10.1149/07702.0071ecst
LA  - en
M1  - 77
PB  - ECS Transactions Vol 76, 2017: Dielectrics for Nanosystems 8: Materials Science, Processing, 
Reliability, and 
Manufacturing -and- Solid State Topics, New orleans, LA, US
PY  - 2017
TI  - Understanding the Pre-Failure Thermo-Mechanical Issues In Electromigration of TSV Enabled 3D ICs
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=922466
ER  -