TY  - JOUR
AU  - Rodriguez, J
AU  - Jr., Allen Hefner
AU  - Berning, David
AU  - Velez-Reyes, M
AU  - Hernandez, Madelaine
AU  - Gonz¿lez, Jorge
C2  - IEEE Transactions on Electronic Packaging
DA  - 2004-08-15 00:08:00
LA  - en
PB  - IEEE Transactions on Electronic Packaging
PY  - 2004
TI  - Lumped-Parameter Thermal Modeling of an IPEM using Thermal Component Models
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31864
ER  -