TY  - JOUR
AU  - Josell, Daniel
AU  - Wallace, William
AU  - Warren, James
AU  - Wheeler, Daniel
AU  - Powell, Aadam
C2  - Journal of Electronic Packaging
DA  - 2002-01-01 00:01:00
LA  - en
M1  -  124(3)
PB  - Journal of Electronic Packaging
PY  - 2002
TI  - Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853827
ER  -