TY  - JOUR
AU  - Pyo, S
AU  - Kim, S
AU  - Wheeler, Daniel
AU  - Moffat, Thomas
AU  - Josell, Daniel
C2  - Journal of Applied Physics
DA  - 2003-01-01 00:01:00
LA  - en
M1  - 93 No. 2
PB  - Journal of Applied Physics
PY  - 2003
TI  - Seam-Free Fabrication of Sub-Micrometer Copper Interconnects by Iodine-Catalyzed Chemical Vapor Deposition
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853178
ER  -