TY  - JOUR
AU  - XU, Di
AU  - Sriram, Vinay
AU  - Ozolins, Vidvuds
AU  - Yang, Jenn-Ming
AU  - Tu, K.
AU  - Stafford, Gery
AU  - Beauchamp, Carlos
AU  - Zienert, Inka
AU  - Geisler, Holm
AU  - Hofmann, Petra
AU  - Zschech, Ehrenfried
C2  - Microelectronic Engineering
DA  - 2008-05-03 00:05:00
LA  - en
PB  - Microelectronic Engineering
PY  - 2008
TI  - Nanotwin formation and its physical properties and effect on reliability of copper interconnects.
ER  -