TY  - CONF
AU  - Williams, Dylan
AU  - Chamberlin, Richard
AU  - Cheron, Jerome
AU  - Chitwood, Sam
AU  - Willis, Ken
AU  - Butler, Brad
AU  - Yazdani, Farhang
C2  - DesignCon 2020 Proceedings, Santa Clara, CA, US
DA  - 2020-01-27 05:01:00
LA  - en
PB  - DesignCon 2020 Proceedings, Santa Clara, CA, US
PY  - 2020
TI  - DARPA Organic Interconnect Characterization
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=929182
ER  -